Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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10/20/2020
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Application #:
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16304908
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Filing Dt:
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11/27/2018
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Publication #:
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Pub Dt:
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10/03/2019
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Inventors:
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Takenori TAKIGUCHI, Kohei HIGASHIGUCHI, Tsuyoshi KIDA
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Title:
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RESIN COMPOSITION, LAMINATE INCLUDING THE RESIN COMPOSITION, SEMICONDUCTOR WAFER WITH RESIN COMPOSITION LAYER, SUBSTRATE FOR MOUNTING SEMICONDUCTOR WITH RESIN COMPOSITION LAYER, AND SEMICONDUCTOR DEVICE INCLUDING THE SEMICONDUCTOR WAFER WITH RESIN COMPOSITION LAYER
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 5-2, MARUNOUCHI 2-CHOME, CHIYODA-KU |
| TOKYO, JAPAN 1008324 |
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| GREENBLUM & BERNSTEIN P.L.C. |
| 1950 ROLAND CLARKE PLACE |
| RESTON, VA 20191 |
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