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Patent Assignment Abstract of Title
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Total Assignments: 3
Patent #:
Issue Dt:
10/20/2020
Application #:
16405693
Filing Dt:
05/07/2019
Publication #:
Pub Dt:
04/02/2020
Inventor:
Kwang Ok Jeong
Title:
SEMICONDUCTOR PACKAGE
Assignment: 1
Reel/Frame:
049396/0790Recorded: 06/06/2019Pages: 3
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignor:
Exec Dt:
04/24/2019
Assignee:
MAEYOUNG-RO 150 (MAETAN-DONG), YOUNGTONG-GU
SUWON-SI, GYEONGGI-DO, KOREA, REPUBLIC OF
Correspondent:
MORGAN, LEWIS & BOCKIUS LLP
1111 PENNSYLVANIA AVENUE NW
WASHINGTON, DC 20004
Assignment: 2
Reel/Frame:
049484/0001Recorded: 06/17/2019Pages: 7
Conveyance:
CORRECTIVE ASSIGNMENT TO CORRECT THE SPELLING OF THE INVETORS NAME PREVIOUSLY RECORDED AT REEL: 049396 FRAME: 0790. ASSIGNOR(S) HEREBY CONFIRMS THE ASSIGNMENT.
Assignor:
Exec Dt:
04/24/2019
Assignee:
MAEYOUNG-RO 150 (MAETAN-DONG), YOUNGTONG-GU
SUWON-SI, GYEONGGI-DO, KOREA, REPUBLIC OF
Correspondent:
MORGAN, LEWIS & BOCKIUS LLP
1111 PENNSYLVANIA AVENUE NW
WASHINGTON, DC 20004
Assignment: 3
Reel/Frame:
049350/0756Recorded: 06/03/2019Pages: 8
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignor:
Exec Dt:
06/01/2019
Assignee:
129, SAMSUNG-RO, YEONGTONG-GU
SUWON-SI, GYEONGGI-DO, KOREA, REPUBLIC OF
Correspondent:
MORGAN LEWIS & BOCKIUS LLP
1111 PENNSYLVANIA AVENUE, NW
WASHINGTON, DC 20004

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