Patent Assignment Abstract of Title
NOTE:Results display only for issued patents and published applications.
For pending or abandoned applications please consult USPTO staff.
|
Total Assignments:
1
|
|
Patent #:
|
|
Issue Dt:
|
10/20/2020
|
Application #:
|
15068891
|
Filing Dt:
|
03/14/2016
|
|
Publication #:
|
|
Pub Dt:
|
07/21/2016
| | | | |
|
Inventors:
|
Jean AUDET, Edmund D. BLACKSHEAR, Masahiro FUKUI, Charles L. REYNOLDS, Kenji TERADA et al
|
|
Title:
|
MULTI-LAYER CIRCUIT USING METAL LAYERS AS A MOISTURE DIFFUSION BARRIER FOR ELECTRICAL PERFORMANCE
|
|
|
Assignment:
1
|
|
|
|
|
|
|
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
|
|
|
|
|
|
|
|
|
| NEW ORCHARD ROAD |
| ARMONK, NEW YORK 10504 |
|
|
|
| 656 ICHIMIYAKE |
| YASU-CITY, SHIGA, JAPAN 520-2362 |
|
|
|
|
| ANDREW M. CALDERON |
| 7918 JONES BRANCH DRIVE, SUITE 500 |
| MCLEAN, VA 22102 |
|
|
Search Results as of:
04/19/2024 07:55 PM
If you have any comments or questions concerning the data displayed,
contact
PRD / Assignments at 571-272-3350. v.2.6
Web interface last modified:
August 25, 2017 v.2.6
|
