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Patent Assignment Abstract of Title
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Total Assignments: 1
Patent #:
Issue Dt:
11/17/2020
Application #:
16308524
Filing Dt:
12/10/2018
Publication #:
Pub Dt:
06/06/2019
Inventors:
Lakshya J. Deka, Hua Liu, Abhay Naik
Title:
MULTI-LAYER ENCAPSULATION SYSTEM FOR JOINT SEALING OF VACUUM INSULATED CABINETS
Assignment: 1
Reel/Frame:
047720/0944Recorded: 12/10/2018Pages: 4
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignors:
Exec Dt:
02/09/2017
Exec Dt:
02/07/2017
Exec Dt:
02/07/2017
Assignee:
2000 NORTH M-63
BENTON HARBOR, MICHIGAN 49022
Correspondent:
PRICE HENEVELD LLP WHIRLPOOL CORPORATION
2000 NORTH M63
BENTON HARBOR, MI 49022

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