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Patent Assignment Abstract of Title
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Total Assignments: 1
Patent #:
Issue Dt:
11/17/2020
Application #:
16234087
Filing Dt:
12/27/2018
Publication #:
Pub Dt:
07/04/2019
Inventors:
Kiyohiko MAEDA, Yasuhiro MEGAWA, Masato TERASAKI, Takahiro MIYAKURA, Akito HIRANO et al
Title:
METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE, SUBSTRATE PROCESSING APPARATUS, AND RECORDING MEDIUM
Assignment: 1
Reel/Frame:
047944/0370Recorded: 01/09/2019Pages: 10
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignors:
Exec Dt:
12/18/2018
Exec Dt:
12/18/2018
Exec Dt:
12/18/2018
Exec Dt:
12/18/2018
Exec Dt:
12/18/2018
Exec Dt:
12/18/2018
Assignee:
3-4, KANDAKAJI-CHO,
CHIYODA-KU
TOKYO, JAPAN 101-0045
Correspondent:
VOLPE AND KOENIG, P.C.
30 S. 17TH STREET
SUITE 1800
PHILADELPHIA, PA 19103

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