Patent Assignment Abstract of Title
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Total Assignments:
3
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Patent #:
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Issue Dt:
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11/24/2020
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Application #:
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16085596
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Filing Dt:
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09/17/2018
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Publication #:
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Pub Dt:
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04/04/2019
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Inventors:
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Yoshiki SUTO, Teppei NISHIYAMA
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Title:
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POLYAMIDE ACID, THERMOPLASTIC POLYIMIDE, RESIN FILM, METAL-CLAD LAMINATE AND CIRCUIT BOARD
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 14-1, SOTOKANDA 4-CHOME, CHIYODA-KU, |
| TOKYO, JAPAN 101-0021 |
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| JCIPRNET |
| P.O. BOX 600 TAIPEI GUTING |
| TAIPEI CITY, 10099 TAIWAN |
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Assignment:
2
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CHANGE OF NAME (SEE DOCUMENT FOR DETAILS).
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| 14-1, SOTOKANDA 4-CHOME, CHIYODA-KU, |
| TOKYO, JAPAN |
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| JCIPRNET |
| P.O. BOX 600 TAIPEI GUTING |
| TAIPEI CITY, 10099 TAIWAN |
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Assignment:
3
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| 13-1, NIHONBASHI 1-CHOME, CHUO-KU, |
| TOKYO, JAPAN 103-0027 |
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| JCIPRNET |
| P.O. BOX 600 TAIPEI GUTING |
| TAIPEI CITY, 10099 TAIWAN |
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