Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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11/24/2020
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Application #:
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16128034
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Filing Dt:
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09/11/2018
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Publication #:
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Pub Dt:
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10/10/2019
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Inventors:
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Yu-Chia Lai, Kuo Lung Pan, Hung-Yi Kuo, Tin-Hao Kuo, Hao-Yi Tsai, Chung-Shi Liu et al
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Title:
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MULTI-CHIP SEMICONDUCTOR PACKAGE
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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AT 8, LI-HSIN RD. 6 HSINCHU SCIENCE PARK |
HSINCHU, TAIWAN 300-78 |
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SLATER MATSIL, LLP/TSMC |
17950 PRESTON ROAD, SUITE 1000 |
DALLAS, TX 75252 |
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05/21/2024 07:08 AM
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