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Patent Assignment Abstract of Title
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Total Assignments: 1
Patent #:
Issue Dt:
12/08/2020
Application #:
16356272
Filing Dt:
03/18/2019
Publication #:
Pub Dt:
09/26/2019
Inventors:
Ying Trickett, Kai-Hung Yu, Nicholas Joy, Kaoru Maekawa, Robert Clark
Title:
PLATFORM AND METHOD OF OPERATING FOR INTEGRATED END-TO-END CMP-LESS INTERCONNECT PROCESS
Assignment: 1
Reel/Frame:
049072/0766Recorded: 05/03/2019Pages: 5
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignors:
Exec Dt:
04/04/2019
Exec Dt:
04/04/2019
Exec Dt:
04/04/2019
Exec Dt:
04/04/2019
Exec Dt:
04/15/2019
Assignee:
AKASAKA BIZ TOWER
3-1 AKASAKA 5-CHOME
MINATO-KU, TOKYO, JAPAN 107-6325
Correspondent:
TOKYO ELECTRON U.S. HOLDINGS, INC.
2400 GROVE BLVD.
AUSTIN, TX 78741

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