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Patent Assignment Abstract of Title
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Total Assignments: 1
Patent #:
10861751
Issue Dt:
12/08/2020
Application #:
16687152
Filing Dt:
11/18/2019
Publication #:
20200083112
Pub Dt:
03/12/2020
Inventors:
De-Wei YU, Chia Ping LO, Liang-Gi YAO, Weng CHANG, Yee-Chia YEO, Ziwei FANG
Title:
METHOD OF SEMICONDUCTOR INTEGRATED CIRCUIT FABRICATION
Assignment: 1
Reel/Frame:
051821/0991Recorded: 02/14/2020Pages: 7
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignors:
YU, DE-WEI
Exec Dt:
09/30/2016
LO, CHIA PING
Exec Dt:
10/18/2016
YAO, LIANG-GI
Exec Dt:
10/18/2016
CHANG, WENG
Exec Dt:
10/03/2016
YEO, YEE-CHIA
Exec Dt:
10/03/2016
FANG, ZIWEI
Exec Dt:
09/30/2016
Assignee:
TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
NO. 8, LI-HSIN RD. 6
SCIENCE-BASED INDUSTRIAL PARK
HSIN-CHU, TAIWAN 300-77
Correspondent:
HAYNES AND BOONE, LLP IP SECTION
2323 VICTORY AVENUE
SUITE 700
DALLAS, TX 75219

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