Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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12/08/2020
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Application #:
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16415009
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Filing Dt:
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05/17/2019
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Publication #:
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Pub Dt:
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11/19/2020
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Inventors:
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Chih-Wei Wu, Li-Chung Kuo, Pu Wang, Ying-Ching Shih, Szu-Wei Lu, Kung-Chen Yeh
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Title:
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Dummy Die Placement Without Backside Chipping
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 8, LI-HSIN RD. 6, HSINCHU SCIENCE PARK |
| HSINCHU, TAIWAN 300-78 |
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| SLATER MATSIL, LLP |
| 17950 PRESTON RD., SUITE 1000 |
| DALLAS, TX 75252 |
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