Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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12/08/2020
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Application #:
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16140468
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Filing Dt:
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09/24/2018
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Publication #:
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Pub Dt:
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02/20/2020
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Inventors:
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Yangbo Jiang, Ya Jun Wang, Liang Hui Wu, Jingping Zhang
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Title:
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METHODS FOR FORMING STRUCTURALLY- REINFORCED SEMICONDUCTOR PLUG IN THREE-DIMENSIONAL MEMORY DEVICE
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 18 GAOXIN 4TH ROAD |
| EAST LAKE HIGH-TECH DEVELOPMENT ZONE |
| WUHAN, CHINA |
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| BAYES PLLC |
| 1765 GREENSBORO STATION PLACE |
| SUITE 900 |
| MCLEAN, VA 22102 |
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