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Patent Assignment Abstract of Title
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Total Assignments: 1
Patent #:
Issue Dt:
12/15/2020
Application #:
16571502
Filing Dt:
09/16/2019
Publication #:
Pub Dt:
04/16/2020
Inventor:
Toshiaki FUKUNAKA
Title:
SEMICONDUCTOR ELEMENT INCLUDING ENCAPSULATED LEAD FRAMES
Assignment: 1
Reel/Frame:
050383/0254Recorded: 09/16/2019Pages: 2
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignor:
Exec Dt:
09/13/2019
Assignee:
1-1-2 YURAKUCHO, CHIYODA-KU
TOKYO, JAPAN 100-0006
Correspondent:
JEFFREY G. KILLIAN
MORGAN, LEWIS & BOCKIUS LLP
1111 PENNSYLVANIA AVENUE, NW
WASHINGTON, DC 20004

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