Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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12/29/2020
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Application #:
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16389992
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Filing Dt:
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04/21/2019
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Publication #:
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Pub Dt:
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10/22/2020
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Inventors:
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Yung-Ping Chiang, Chung-Shi Liu, Han-Ping Pu, Ming-Kai Liu, Ting-Chu Ko, Chang-Wen Huang et al
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Title:
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SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| NO.8, LI-HSIN RD. 6, HSINCHU SCIENCE PARK, |
| HSINCHU, TAIWAN 30078 |
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| JCIPRNET |
| P.O. BOX 600 TAIPEI GUTING, |
| TAIPEI CITY, 10099 TAIWAN |
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