Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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01/12/2021
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Application #:
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16462681
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Filing Dt:
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05/21/2019
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Publication #:
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Pub Dt:
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03/12/2020
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Inventors:
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Hiroaki Umeda, Kazuhiro Matsuda, Ken Yukawa
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Title:
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HEAT DISSIPATION SUBSTRATE, HEAT DISSIPATION CIRCUIT STRUCTURE BODY, AND METHOD FOR MANUFACTURING THE SAME
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 3-1, IWATA-CHO 2-CHOME |
| HIGASHIOSAKA-SHI, OSAKA, JAPAN 578-8585 |
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| WESTERMAN HATTORI DANIELS & ADRIAN LLP |
| 8500 LEESBURG PIKE, SUITE 7500 |
| TYSONS, VA 22182 |
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