Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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01/12/2021
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Application #:
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16813530
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Filing Dt:
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03/09/2020
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Publication #:
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Pub Dt:
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07/02/2020
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Inventors:
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Kenji IWAMOTO, Satoshi KUROSAWA
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Title:
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MICROCAPSULE, SHEET MATERIAL, CIRCUIT BOARD, METHOD FOR MANUFACTURING CIRCUIT BOARD, AND COMPUTER READABLE STORAGE MEDIUM
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 6-2, HON-MACHI 1-CHOME |
| SHIBUYA-KU, TOKYO, JAPAN 151-8543 |
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| HOLTZ, HOLTZ & VOLEK PC |
| 630 NINTH AVENUE |
| SUITE 1010 |
| NEW YORK, NY 10036-3744 |
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