Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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02/02/2021
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Application #:
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16145026
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Filing Dt:
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09/27/2018
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Publication #:
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Pub Dt:
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08/29/2019
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Inventors:
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In Seob BAE, Sung Il KANG, Dong Jin YOON
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Title:
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METHOD OF MANUFACTURING SEMICONDUCTOR PACKAGE SUBSTRATE AND SEMICONDUCTOR PACKAGE SUBSTRATE MANUFACTURED USING THE METHOD, AND METHOD OF MANUFACTURING SEMICONDUCTOR PACKAGE AND SEMICONDUCTOR PACKAGE MANUFACTURED USING THE METHOD
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 726, UNGNAM-RO, SEONGSAN-GU |
| GYEONGSANGNAM-DO |
| CHANGWON-SI, KOREA, REPUBLIC OF 51552 |
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| SCHWABE WILLIAMSON & WYATT, P.C. |
| 1211 SW FIFTH AVENUE |
| SUITE 1900 |
| PORTLAND, OR 97204 |
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