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Patent Assignment Abstract of Title
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Total Assignments: 1
Patent #:
Issue Dt:
02/02/2021
Application #:
16618899
Filing Dt:
12/03/2019
Publication #:
Pub Dt:
03/19/2020
Inventors:
Bong-Gyun KO, Toshiaki ONO
Title:
SILICON WAFER MANUFACTURING METHOD
Assignment: 1
Reel/Frame:
051162/0188Recorded: 12/03/2019Pages: 5
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignors:
Exec Dt:
10/30/2019
Exec Dt:
10/30/2019
Assignee:
2-1, SHIBAURA 1-CHOME, MINATO-KU
TOKYO, JAPAN 105-8634
Correspondent:
GREENBLUM & BERNSTEIN, P.L.C.
1950 ROLAND CLARKE PLACE
RESTON, VA 20191

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