Patent Assignment Abstract of Title
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Total Assignments:
2
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Patent #:
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Issue Dt:
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02/23/2021
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Application #:
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15830232
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Filing Dt:
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12/04/2017
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Publication #:
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Pub Dt:
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08/09/2018
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Inventors:
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Philip Measor, Robert M. Danen
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Title:
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Three-Dimensional Calibration Structures and Methods for Measuring Buried Defects on a Three-Dimensional Semiconductor Wafer
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| ONE TECHNOLOGY DRIVE |
| MILPITAS, CALIFORNIA 95035 |
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| SUITER SWANTZ/KLA JOINT CUSTOMER NUMBER |
| 14301 FNB PARKWAY |
| SUITE 220 |
| OMAHA, NE 68154-5299 |
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Assignment:
2
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CHANGE OF NAME (SEE DOCUMENT FOR DETAILS).
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| ONE TECHNOLOGY DRIVE |
| MILPITAS, CALIFORNIA 95035 |
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| SUITER SWANTZ/KLA JOINT CUSTOMER NUMBER |
| 14301 FNB PARKWAY, SUITE 220 |
| OMAHA, NE 68154 |
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