Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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02/23/2021
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Application #:
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16355847
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Filing Dt:
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03/18/2019
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Publication #:
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Pub Dt:
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06/11/2020
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Inventors:
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Chun-Chieh Wang, Wen-Neng Liao, Cheng-Wen Hsieh, Wei-Chin Chen, Jau-Han Ke
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Title:
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HEAT DISSIPATION MODULE
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 8F., NO.88, SEC. 1, XINTAI 5TH RD., XIZHI DIST., |
| NEW TAIPEI CITY, TAIWAN 221 |
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| JCIPRNET |
| P.O. BOX 600 TAIPEI GUTING |
| TAIPEI CITY, 10099 TAIWAN |
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