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Patent Assignment Abstract of Title
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Total Assignments: 2
Patent #:
10930590
Issue Dt:
02/23/2021
Application #:
16549110
Filing Dt:
08/23/2019
Publication #:
20210057327
Pub Dt:
02/25/2021
Inventors:
Dian-Sheg Yu, Ren-Fen Tsui, Jhon Jhy Liaw, Ying-Jhe Fu
Title:
INTERCONNECT DEVICE AND METHOD
Assignment: 1
Reel/Frame:
050349/0115Recorded: 09/11/2019Pages: 3
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignors:
YU, DIAN-SHEG
Exec Dt:
09/03/2019
TSUI, REN-FEN
Exec Dt:
09/03/2019
LIAW, JOHN JHY
Exec Dt:
09/03/2019
FU, YING-JHE
Exec Dt:
09/03/2019
Assignee:
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
8, LI-HSIN RD. 6
HSINCHU SCIENCE PARK
HSINCHU, TAIWAN 300-78
Correspondent:
SLATER MATSIL, LLP/TSMC
17950 PRESTON ROAD, SUITE 1000
DALLAS, TX 75252
Assignment: 2
Reel/Frame:
055681/0899Recorded: 03/23/2021Pages: 4
Conveyance:
CORRECTIVE ASSIGNMENT TO CORRECT THE TYPOGRAPHICAL ERROR IN THE 3RD INVENTOR'S NAME PREVIOUSLY RECORDED AT REEL: 050349 FRAME: 0115. ASSIGNOR(S) HEREBY CONFIRMS THE ASSIGNMENT.
Assignors:
YU, DIAN-SHEG
Exec Dt:
09/03/2019
TSUI, REN-FEN
Exec Dt:
09/03/2019
LIAW, JHON JHY
Exec Dt:
03/12/2021
FU, YING-JHE
Exec Dt:
09/03/2019
Assignee:
TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
8, LI-HSIN RD. 6
HSINCHU SCIENCE PARK
HSINCHU, TAIWAN 300-78
Correspondent:
SLATER MATSIL LLP/TSMC
17950 PRESTON ROAD, SUITE 1000
DALLAS, TX 75252

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