Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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03/09/2021
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Application #:
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16186676
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Filing Dt:
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11/12/2018
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Publication #:
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Pub Dt:
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03/14/2019
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Inventors:
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Shinji Arimoto, Takenori Fujiwara, Masao Tomikawa
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Title:
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ADHESIVE FOR TEMPORARY BONDING, ADHESIVE LAYER, WAFER WORK PIECE AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE USING SAME, REWORK SOLVENT, POLYIMIDE COPOLYMER, POLYIMIDE MIXED RESIN, AND RESIN COMPOSTION
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 1-1, NIHONBASHI-MUROMACHI 2-CHOME |
| CHUO-KU |
| TOKYO, JAPAN 1038666 |
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| RATNERPRESTIA |
| 2200 RENAISSANCE BLVD |
| SUITE 350 |
| KING OF PRUSSIA, PA 19406 |
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