Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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03/09/2021
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Application #:
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16561092
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Filing Dt:
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09/05/2019
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Publication #:
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Pub Dt:
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12/26/2019
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Inventors:
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Masaya MIYAKE, Hiroki NAITO, Fumihiro MUKAI
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Title:
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THERMALLY CONDUCTIVE RESIN MOLDED ARTICLE
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 6-6, MINATOJIMA MINAMIMACHI 4-CHOME, CHUO-KU |
| KOBE-SHI, HYOGO, JAPAN 650-0047 |
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| SHERYL NEUMANN |
| PANITCH SCHWARZE BELISARIO & NADEL |
| 2005 MARKET ST., SUITE 2800 |
| PHILADELPHIA, PA 19103 |
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