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Patent Assignment Abstract of Title
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Total Assignments: 1
Patent #:
Issue Dt:
03/09/2021
Application #:
16817705
Filing Dt:
03/13/2020
Inventors:
Ryo Hosoi, Takashi Honda, Sik Fun Chan, Dayu Zhou, Seiichi Takayama, Tai Boon Lee
Title:
Thermally Assisted Magnetic Head, Head Gimbal Assembly, Hard Disk Drive and Method of Manufacturing the Thermally Assisted Magnetic Head
Assignment: 1
Reel/Frame:
052159/0807Recorded: 03/19/2020Pages: 8
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignors:
Exec Dt:
03/06/2020
Exec Dt:
03/06/2020
Exec Dt:
03/06/2020
Exec Dt:
03/17/2020
Exec Dt:
03/06/2020
Exec Dt:
03/06/2020
Assignees:
SAE TECHNOLOGY CENTRE, 6 SCIENCE PARK EAST AVENUE
HONG KONG SCIENCE PARK, SHATIN, N.T.
HONG KONG, HONG KONG
682 SOUTH HILLVIEW DRIVE
MILPITAS, CALIFORNIA 95035
Correspondent:
BYIP LTD.
5700 GRANITE PARKWAY, SUITE 200
PLANO, TX 75024

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