Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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03/09/2021
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Application #:
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16817705
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Filing Dt:
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03/13/2020
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Inventors:
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Ryo Hosoi, Takashi Honda, Sik Fun Chan, Dayu Zhou, Seiichi Takayama, Tai Boon Lee
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Title:
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Thermally Assisted Magnetic Head, Head Gimbal Assembly, Hard Disk Drive and Method of Manufacturing the Thermally Assisted Magnetic Head
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Assignment:
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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SAE TECHNOLOGY CENTRE, 6 SCIENCE PARK EAST AVENUE |
HONG KONG SCIENCE PARK, SHATIN, N.T. |
HONG KONG, HONG KONG |
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682 SOUTH HILLVIEW DRIVE |
MILPITAS, CALIFORNIA 95035 |
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BYIP LTD. |
5700 GRANITE PARKWAY, SUITE 200 |
PLANO, TX 75024 |
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05/09/2024 09:21 AM
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