Patent Assignment Abstract of Title
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Total Assignments:
2
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Patent #:
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Issue Dt:
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03/16/2021
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Application #:
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16313825
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Filing Dt:
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12/27/2018
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Publication #:
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Pub Dt:
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10/24/2019
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Inventors:
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Tomohiro UNO, Tetsuya OYAMADA, Takashi YAMADA, Daizo ODA, Motoki ETO
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Title:
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BONDING WIRE FOR SEMICONDUCTOR DEVICE
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 14-1, SOTOKANDA 4-CHOME, CHIYODA-KU |
| TOKYO, JAPAN 101-0021 |
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| 158-1 OAZA SAYAMAGAHARA, IRUMA-SHI |
| SAITAMA, JAPAN 358-0032 |
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| MCDERMOTT WILL & EMERY LLP |
| THE MCDERMOTT BUILDING |
| 500 NORTH CAPITOL STREET, N.W. |
| WASHINGTON, DC 20001 |
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Assignment:
2
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CHANGE OF ADDRESS FOR NIPPON STEEL CHEMICAL & MATERIAL CO., LTD.
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| 13-1, NIHONBASHI 1-CHOME, CHUO-KU |
| TOKYO, JAPAN 103-0027 |
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| TOMOKI TANIDA |
| MCDERMOTT WILL & EMERY LLP |
| 500 NORTH CAPITOL STREET, N.W. |
| WASHINGTON, DC 20001 |
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