Patent Assignment Abstract of Title
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Total Assignments:
2
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Patent #:
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Issue Dt:
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03/16/2021
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Application #:
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16333584
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Filing Dt:
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03/14/2019
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Publication #:
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Pub Dt:
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08/22/2019
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Inventors:
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Jae-Sik MIN, Jae-Yeop LEE, Byoung-Gu CHO, Byoung-Chul CHO, Byoung-Kwon CHO
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Title:
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ROUND CHIP SCALE PACKAGE AND MANUFACTURING METHOD THEREFOR
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| #303, MEMSNANO PARTS PRODUCTION CENTER IN PUSAN NATIONAL UNIVERSITY |
| 2-1, BUSANDAEHAK-RO 63BEON-GIL GEUMJEONG-GU |
| BUSAN, KOREA, DEMOCRATIC PEOPLE'S REPUBLIC OF 46239 |
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| MCCOY RUSSELL LLP |
| 806 SW BROADWAY |
| SUITE 600 |
| PORTLAND, OR 97205-3335 |
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Assignment:
2
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CHANGE OF NAME (SEE DOCUMENT FOR DETAILS).
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| CHANGDUK-DONG, YONGIN TECHNO VALLEY KNOWLEDGE INDUSTRY CENTER |
| A907-HO, A-DONG A906-HO, 357, GUSEONG-RO, GIHEUNG-GU, YONGINSI |
| GYEONGGI-DO, KOREA, DEMOCRATIC PEOPLE'S REPUBLIC OF 16914 |
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| THE BELLES GROUP P.C. |
| 1800 JOHN F. KENNEDY BOULEVARD SUITE 1010 |
| PHILADELPHIA, PA 19103 |
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