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Patent Assignment Abstract of Title
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Total Assignments: 1
Patent #:
Issue Dt:
03/23/2021
Application #:
16231752
Filing Dt:
12/24/2018
Publication #:
Pub Dt:
06/25/2020
Inventors:
Shigehisa Inoue, Hironori Matsuoka, Yuji TOTOKI, Yuki Kasai
Title:
THREE-DIMENSIONAL MEMORY DEVICES HAVING A MULTI-STACK BONDED STRUCTURE USING A LOGIC DIE AND MULTIPLE THREE-DIMENSIONAL MEMORY DIES AND METHOD OF MAKING THE SAME
Assignment: 1
Reel/Frame:
047858/0453Recorded: 12/27/2018Pages: 4
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignors:
Exec Dt:
12/17/2018
Exec Dt:
12/17/2018
Exec Dt:
12/17/2018
Exec Dt:
12/17/2018
Assignee:
5080 SPECTRUM DRIVE
SUITE 1050W
ADDISON, TEXAS 75001
Correspondent:
THE MARBURY LAW GROUP, PLLC
11800 SUNRISE VALLEY DRIVE
15TH FLOOR
RESTON, VA 20191

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