Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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03/30/2021
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Application #:
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16283928
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Filing Dt:
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02/25/2019
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Inventors:
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Shen-Nan LEE, Teng-Chun TSAI, Chu-An LEE, Chen-Hao WU, Chun-Hung LIAO, Huang-Lin CHAO
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Title:
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WAFER POLISHING WITH SEPARATED CHEMICAL REACTION AND MECHANICAL POLISHING
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| NO. 8, LI-HSIN ROAD 6 |
| HSIN-CHU SCIENCE PARK |
| HSIN-CHU, TAIWAN 300-77 |
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| COOPER LEGAL GROUP LLC |
| 6505 ROCKSIDE ROAD SUITE 330 |
| INDEPENDENCE, OH 44131 |
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