Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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04/13/2021
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Application #:
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16678557
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Filing Dt:
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11/08/2019
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Inventors:
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Raymond C. Rumpf, Cesar Luis Valle, Gilbert Carranza, Ubaldo Robles
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Title:
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3D VOLUMETRIC CIRCUITS AND ASSOCIATED METHODS
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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201 WEST 7TH STREET |
AUSTIN, TEXAS 78701 |
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DUKE W. YEE |
YEE & ASSOCIATES, P.C. |
P.O. BOX 190809 |
DALLAS, TX 75219 |
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05/14/2024 10:13 AM
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