Patent Assignment Abstract of Title
NOTE:Results display only for issued patents and published applications.
For pending or abandoned applications please consult USPTO staff.
|
Total Assignments:
1
|
|
Patent #:
|
|
Issue Dt:
|
04/13/2021
|
Application #:
|
16219415
|
Filing Dt:
|
12/13/2018
|
|
Publication #:
|
|
Pub Dt:
|
06/20/2019
| | | | |
|
Inventors:
|
Thomas Bemmerl, Kuok Wai Chan, Christoph Liebl, Bun Kian Tay, Wee Boon Tay, Wae Chet Yong
|
|
Title:
|
Encapsulated Leadless Package Having an at Least Partially Exposed Interior Sidewall of a Chip Carrier
|
|
|
Assignment:
1
|
|
|
|
|
|
|
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
|
|
|
|
|
|
|
|
|
| AM CAMPEON 1-15 |
| NEUBIBERG, GERMANY 85579 |
|
|
|
|
| MURPHY, BILAK & HOMILLER/INFINEON TECHNO |
| 1255 CRESCENT GREEN |
| SUITE 200 |
| CARY, NC 27518 |
|
|
Search Results as of:
05/09/2024 08:35 AM
If you have any comments or questions concerning the data displayed,
contact
PRD / Assignments at 571-272-3350. v.2.6
Web interface last modified:
August 25, 2017 v.2.6
|
