Patent Assignment Abstract of Title
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Total Assignments:
2
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Patent #:
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Issue Dt:
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04/13/2021
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Application #:
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16474589
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Filing Dt:
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06/28/2019
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Publication #:
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Pub Dt:
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02/13/2020
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Inventors:
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Kristof Darmawikarta, Robert Alan May, Sri Ranga Sai Sai Boyapati, Wei-Lun Kane Jen et al
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Title:
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Die Interconnect Substrate, an Electrical Device, and a Method for Forming a Die Interconnect Substrate
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 2200 MISSION COLLEGE BOULEVARD |
| SANTA CLARA, CALIFORNIA 95054 |
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| 2SPL PATENT ATTORNEYS PARTG MBB |
| LANDAUBOGEN 3 |
| MUNICH, 81373 GERMANY |
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Assignment:
2
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| BLANCHARDSTOWN CORPORATE PARK 2 |
| PLAZA 255, SUITE 2A |
| DUBLIN, IRELAND D15 YH6H |
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| TAHOE RESEARCH, LTD. |
| BLANCHARDSTOWN CORPORATE PARK 2 |
| PLAZA 255, SUITE 2A |
| DUBLIN, D15 YH6H IRELAND |
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