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Patent Assignment Abstract of Title
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Total Assignments: 1
Patent #:
10979610
Issue Dt:
04/13/2021
Application #:
16484292
Filing Dt:
08/07/2019
Publication #:
20200007726
Pub Dt:
01/02/2020
Inventors:
Mingzhu WANG, Zhongyu LUAN, Liefeng CHEN, Duanliang CHENG, Bojie ZHAO, Takehiko TANAKA et al
Title:
CAMERA MODULE, MOLDING PHOTOSENSITIVE ASSEMBLY THEREOF, MANUFACTURING METHOD AND ELECTRONIC DEVICE
Assignment: 1
Reel/Frame:
049990/0205Recorded: 08/07/2019Pages: 4
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignors:
WANG, MINGZHU
Exec Dt:
07/26/2019
LUAN, ZHONGYU
Exec Dt:
07/19/2019
CHEN, LIEFENG
Exec Dt:
07/19/2016
CHENG, DUANLIANG
Exec Dt:
07/29/2019
ZHAO, BOJIE
Exec Dt:
07/25/2019
TANAKA, TAKEHIKO
Exec Dt:
07/19/2019
HUANG, ZHEN
Exec Dt:
07/23/2019
Assignee:
NINGBO SUNNY OPOTECH CO., LTD.
66-68 SHUNYU ROAD, YUYAO CITY, NINGBO
ZHEJIANG, CHINA 315400
Correspondent:
WENDEROTH, LIND & PONACK, LLP.
1025 CONNECTICUT AVENUE, N.W.
SUITE 500
WASHINGTON, DC 20036

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