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Patent Assignment Abstract of Title
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Total Assignments: 1
Patent #:
11004744
Issue Dt:
05/11/2021
Application #:
16774689
Filing Dt:
01/28/2020
Publication #:
20200266102
Pub Dt:
08/20/2020
Inventors:
Shigenori HARADA, Hayato KIUCHI, Taro ARAKAWA, Emiko KAWAMURA, Minoru MATSUZAWA et al
Title:
WAFER PROCESSING METHOD FOR DIVIDING A WAFER ALONG PREDEFINED DIVISION LINES
Assignment: 1
Reel/Frame:
051645/0095Recorded: 01/28/2020Pages: 6
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignors:
HARADA, SHIGENORI
Exec Dt:
01/10/2020
MATSUZAWA, MINORU
Exec Dt:
01/10/2020
KIUCHI, HAYATO
Exec Dt:
01/10/2020
YODO, YOSHIAKI
Exec Dt:
01/09/2020
ARAKAWA, TARO
Exec Dt:
01/14/2020
AGARI, MASAMITSU
Exec Dt:
01/14/2020
KAWAMURA, EMIKO
Exec Dt:
01/10/2020
FUJII, YUSUKE
Exec Dt:
01/10/2020
MIYAI, TOSHIKI
Exec Dt:
01/15/2020
OHMAE, MAKIKO
Exec Dt:
01/14/2020
Assignee:
DISCO CORPORATION
13-11, OMORI-KITA 2-CHOME, OTA-KU,
TOKYO, JAPAN 143-8580
Correspondent:
GREER, BURNS & CRAIN, LTD
300 S. WACKER DR.
SUITE 2500
CHICAGO, IL 60606

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