Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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05/18/2021
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Application #:
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16667698
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Filing Dt:
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10/29/2019
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Publication #:
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Pub Dt:
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04/29/2021
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Inventors:
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Georgios Dogiamis, Aleksandar Aleksov, Feras Eid, Telesphor Kamgaing, Johanna M. Swan
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Title:
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MICROELECTRONIC PACKAGE WITH MOLD-INTEGRATED COMPONENTS
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 2200 MISSION COLLEGE BOULEVARD |
| SANTA CLARA, CALIFORNIA 95054 |
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| MICHAEL S. MOORE |
| PATENT CAPITAL GROUP |
| 2816 LAGO VISTA LANE |
| ROCKWALL, TX 75032 |
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