Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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05/18/2021
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Application #:
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16457479
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Filing Dt:
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06/28/2019
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Publication #:
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Pub Dt:
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10/24/2019
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Inventors:
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Hiromasa KATO, Takashi SANO
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Title:
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Ceramic Copper Circuit Board And Semiconductor Device Based On The Same
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 1-1, SHIBAURA 1-CHOME, MINATO-KU |
| TOKYO, JAPAN 105-8001 |
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| 8, SHINSUGITA-CHO, ISOGO-KU |
| YOKOHAMA-SHI, KANAGAWA, JAPAN 235-8522 |
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| HARNESS DICKEY (TROY) |
| P.O. BOX 828 |
| BLOOMFIELD HILLS, MI 48303 |
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