Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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05/25/2021
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Application #:
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16544234
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Filing Dt:
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08/19/2019
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Publication #:
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Pub Dt:
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01/02/2020
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Inventors:
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Hung-Chia TSAI, Chun-wen CHENG, Lan-Lin CHAO, Yuan-Chih HSIEH, Ping-Yin LIU
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Title:
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METHOD OF FORMING SEMICONDUCTOR PACKAGE AND SEMICONDUCTOR PACKAGE
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| NO. 8, LI-HSIN RD. VI, HSINCHU SCIENCE PARK |
| HSINCHU, TAIWAN 300 |
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| HAUPTMAN HAM, LLP (TSMC) |
| 2318 MILL ROAD |
| SUITE 1400 |
| ALEXANDRIA, VA 22314 |
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