Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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05/25/2021
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Application #:
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16329394
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Filing Dt:
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02/28/2019
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Publication #:
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Pub Dt:
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06/27/2019
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Inventors:
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Kye-Ung LEE, Ho-Young PARK, Tae-Seok LEE
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Title:
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POLYIMIDE FILM FOR SEMICONDUCTOR PACKAGE REFLOW PROCESS, AND MANUFACTURING METHOD THEREFOR
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 272-27, MUNJI-RO, YUSEONG-GU |
| DAEJEON, KOREA, REPUBLIC OF 34050 |
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| HAUPTMAN HAM, LLP |
| 2318 MILL ROAD |
| SUITE 1400 |
| ALEXANDRIA, VA 22314 |
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