Patent Assignment Abstract of Title
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Total Assignments:
2
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Patent #:
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Issue Dt:
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06/08/2021
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Application #:
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16574372
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Filing Dt:
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09/18/2019
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Publication #:
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Pub Dt:
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03/19/2020
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Inventors:
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Jungah KIM, Mihyun PARK, Jinwoo LEE, Keonyoung KIM, Hyosan LEE, Jung Hun LIM, Hoon HAN et al
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Title:
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ETCHING COMPOSITION, A METHOD OF ETCHING A METAL BARRIER LAYER AND A METAL LAYER USING THE SAME, AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE USING THE SAME
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 129, SAMSUNG-RO, YEONGTONG-GU, GYEONGGI-DO |
| SUWON-SI, KOREA, REPUBLIC OF 16677 |
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| SUGHRUE MION, PLLC. |
| 2000 PENNSYLVANIA AVE., NW. |
| 8TH FLOOR |
| WASHINGTON, DC 20006 |
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Assignment:
2
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 34, PANGYO-RO 255 BEON-GIL, BUNDANG-GU, GYEONGGI-DO |
| SEONGNAM-SI, KOREA, REPUBLIC OF |
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| SUGHRUE MION, PLLC. |
| 2000 PENNSYLVANIA AVE., NW. |
| 8TH FLOOR |
| WASHINGTON, DC 20006 |
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