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Patent Assignment Abstract of Title
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Total Assignments: 1
Patent #:
Issue Dt:
06/15/2021
Application #:
16203815
Filing Dt:
11/29/2018
Inventors:
Jeffrey R. Ogorzalek, Sergio V. Martinez, Patrick J. Lott
Title:
LOW COST APPROACH FOR DEPOSITING SOLDER AND ADHESIVES IN A PATTERN FOR FORMING ELECTRONIC ASSEMBLIES
Assignment: 1
Reel/Frame:
047623/0001Recorded: 11/29/2018Pages: 7
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignors:
Exec Dt:
11/27/2018
Exec Dt:
11/28/2018
Exec Dt:
11/26/2018
Assignee:
870 WINTER STREET
WALTHAM, MASSACHUSETTS 02451
Correspondent:
CANTOR COLBURN LLP
20 CHURCH STREET
22ND FLOOR
HARTFORD, CT 06103

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