Patent Assignment Abstract of Title
NOTE:Results display only for issued patents and published applications.
For pending or abandoned applications please consult USPTO staff.
|
Total Assignments:
1
|
|
Patent #:
|
|
Issue Dt:
|
06/15/2021
|
Application #:
|
16312834
|
Filing Dt:
|
12/21/2018
|
|
Publication #:
|
|
Pub Dt:
|
05/30/2019
| | | | |
|
Inventors:
|
Song GUO, Feibiao CHEN, Tianming WANG, Jianqi SUN, Yuebin ZHU, Hai XIA
|
|
Title:
|
A CHIP BONDING DEVICE AND BONDING METHOD THEREOF
|
|
|
Assignment:
1
|
|
|
|
|
|
|
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
|
|
|
|
|
|
|
|
|
| 1525 ZHANGDONG ROAD, ZHANGJIANG HIGH-TECH PARK |
| SHANGHAI, CHINA 201023 |
|
|
|
|
| MUNCY, GEISSLER, OLDS & LOWE, PC |
| 4000 LEGATO RD., SUITE 310 |
| FAIRFAX, VA 22033 |
|
|
Search Results as of:
05/22/2024 08:35 AM
If you have any comments or questions concerning the data displayed,
contact
PRD / Assignments at 571-272-3350. v.2.6
Web interface last modified:
August 25, 2017 v.2.6
|
