Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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06/15/2021
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Application #:
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16521849
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Filing Dt:
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07/25/2019
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Publication #:
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Pub Dt:
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01/28/2021
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Inventors:
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Chen WU, Peter RABKIN, Yangyin CHEN, Masaaki HIGASHITANI
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Title:
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BONDED DIE ASSEMBLY CONTAINING PARTIALLY FILLED THROUGH-SUBSTRATE VIA STRUCTURES AND METHODS FOR MAKING THE SAME
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 5080 SPECTRUM DRIVE |
| SUITE 1050W |
| ADDISON, TEXAS 75001 |
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| THE MARBURY LAW GROUP, PLLC |
| 11800 SUNRISE VALLEY DRIVE |
| 15TH FLOOR |
| RESTON, VA 20191 |
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