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Patent Assignment Abstract of Title
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Total Assignments: 1
Patent #:
11039052
Issue Dt:
06/15/2021
Application #:
16483150
Filing Dt:
08/02/2019
Publication #:
20200244852
Pub Dt:
07/30/2020
Inventors:
Duanliang CHENG, Bojie ZHAO, Zhen HUANG, Nan GUO, Mingzhu WANG, Fengsheng XI et al
Title:
CAMERA MODULE AND MOLDING CIRCUIT BOARD ASSEMBLY, CIRCUIT BOARD AND APPLICATION THEREOF
Assignment: 1
Reel/Frame:
049943/0691Recorded: 08/02/2019Pages: 4
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignors:
WANG, MINGZHU
Exec Dt:
07/26/2019
CHENG, DUANLIANG
Exec Dt:
07/29/2019
XI, FENGSHENG
Exec Dt:
07/23/2019
ZHAO, BOJIE
Exec Dt:
07/25/2019
TANAKA, TAKEHIKO
Exec Dt:
07/19/2019
HUANG, ZHEN
Exec Dt:
07/23/2019
CHEN, ZHENYU
Exec Dt:
07/18/2019
GUO, NAN
Exec Dt:
07/20/2019
Assignee:
NINGBO SUNNY OPOTECH CO., LTD.
66-68 SHUNYU ROAD, YUYAO CITY NINGBO
ZHEJIANG, CHINA 315400
Correspondent:
WENDEROTH, LIND & PONACK, LLP.
1025 CONNECTICUT AVENUE, N.W.
SUITE 500
WASHINGTON, DC 20036

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