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Patent Assignment Abstract of Title
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Total Assignments: 1
Patent #:
Issue Dt:
06/29/2021
Application #:
16358250
Filing Dt:
03/19/2019
Publication #:
Pub Dt:
09/24/2020
Inventors:
Yu-Nien HUANG, Chao-Jung CHEN, Kuen-Hsien WU, Shih-I LIANG
Title:
FLEXIBLE BASE DESIGN FOR CHIPSET HEAT SINK
Assignment: 1
Reel/Frame:
048640/0084Recorded: 03/19/2019Pages: 3
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignors:
Exec Dt:
03/14/2019
Exec Dt:
03/14/2019
Exec Dt:
03/14/2019
Exec Dt:
03/14/2019
Assignee:
NO. 188, WENHUA 2ND RD., GUEISHAN DIST.
TAOYUAN CITY, TAIWAN 33383
Correspondent:
NIXON PEABODY LLP
799 NINTH STREET NW
SUITE 500
WASHINGTON, DC 20001

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