Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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06/29/2021
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Application #:
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16457336
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Filing Dt:
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06/28/2019
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Publication #:
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Pub Dt:
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10/24/2019
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Inventors:
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Aditya S. Vaidya, Ravindranath V. Mahajan, Digvijay A. Raorane, Paul R. Start
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Title:
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EMBEDDED BRIDGE WITH THROUGH-SILICON VIAS
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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2200 MISSION COLLEGE BOULEVARD |
SANTA CLARA, CALIFORNIA 95054 |
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JUSTIN K. BRASK |
1211 SW 5TH AVENUE, STE. 1600 |
PORTLAND, OR 97204 |
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05/16/2024 05:27 PM
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