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Patent Assignment Abstract of Title
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Total Assignments: 1
Patent #:
Issue Dt:
06/29/2021
Application #:
16612606
Filing Dt:
11/11/2019
Publication #:
Pub Dt:
09/24/2020
Inventors:
Zhiqi Wang, Zhiming Geng
Title:
ENCAPSULATION STRUCTURE OF IMAGE SENSING CHIP, AND ENCAPSULATION METHOD THEREFOR
Assignment: 1
Reel/Frame:
051089/0267Recorded: 11/22/2019Pages: 4
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignors:
Exec Dt:
10/22/2019
Exec Dt:
10/21/2019
Assignee:
NO. 29 TINGLAN LANE SIP
SUZHOU, JIANGSU, CHINA 215026
Correspondent:
JAMES H. MORRIS
WOLF, GREENFIELD & SACKS, P.C.
600 ATLANTIC AVENUE
BOSTON, MA 02210

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