Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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07/06/2021
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Application #:
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16563954
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Filing Dt:
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09/09/2019
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Publication #:
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Pub Dt:
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03/19/2020
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Inventors:
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YUN-HSING SUNG, CHUN-YU KAO
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Title:
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MICRO-ROUGHENED ELECTRODEPOSITED COPPER FOIL AND COPPER FOIL SUBSTRATE
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 8F., NO. 392, RUEY KUANG ROAD, NEIHU DIST., |
| TAIPEI CITY, TAIWAN |
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| LI & CAI INTELLECTUAL PROPERTY OFFICE |
| 9F, NO. 69, SEC. 2 DUNHUA S. RD |
| DA''AN DISTRICT |
| TAIPEI, 11106 TAIWAN |
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