Patent Assignment Abstract of Title
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Total Assignments:
3
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Patent #:
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Issue Dt:
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07/06/2021
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Application #:
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16574985
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Filing Dt:
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09/18/2019
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Publication #:
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Pub Dt:
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04/09/2020
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Inventors:
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Seiji Yamasaki, Hirohide Komiyama, Hua Wang, Yanping Zhou
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Title:
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PCB PANEL, PCB, AND MANUFACTURING METHOD
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 979 KING'S ROAD |
| 23/F, LINCOLN HOUSE |
| QUARRY BAY, HONG KONG |
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| JASON FRIDAY |
| 8001 DEVELOPMENT DRIVE |
| LEGAL |
| MORRISVILLE, NC 27560 |
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Assignment:
2
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 151 LORONG CHUAN |
| # 02-01 |
| NEW TECH PARK, SINGAPORE 556741 |
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| BRIAN C. KUNZLER |
| 50 W. BROADWAY, 10TH FLOOR |
| SALT LAKE CITY, UT 84101 |
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Assignment:
3
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 151 LORONG CHUAN |
| # 02-01 |
| NEW TECH PARK, SINGAPORE 556741 |
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| BRIAN C. KUNZLER |
| 50 W. BROADWAY, 10TH FLOOR |
| SALT LAKE CITY, UT 84101 |
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