Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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07/13/2021
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Application #:
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16231964
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Filing Dt:
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12/25/2018
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Publication #:
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Pub Dt:
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04/02/2020
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Inventors:
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Yu-Chia Lai, Chung-Shi Liu, Kuo-Chung Yee, Chen-Hua Yu, Hao-Yi Tsai, Tin-Hao Kuo
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Title:
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PACKAGE STRUCTURES
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| NO.8, LI-HSIN RD. 6, HSINCHU SCIENCE PARK |
| HSINCHU, TAIWAN 30078 |
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| JCIPRNET |
| P.O. BOX 600 TAIPEI GUTING |
| TAIPEI CITY, 10099 TAIWAN |
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