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Patent Assignment Abstract of Title
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Total Assignments: 3
Patent #:
Issue Dt:
07/20/2021
Application #:
16282401
Filing Dt:
02/22/2019
Publication #:
Pub Dt:
08/29/2019
Inventors:
Thomas Feil, Danny Clavette, Carsten von Koblinski
Title:
SEMICONDUCTOR MODULE, ELECTRONIC COMPONENT AND METHOD OF MANUFACTURING A SEMICONDUCTOR MODULE
Assignment: 1
Reel/Frame:
050325/0131Recorded: 09/10/2019Pages: 3
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignor:
Exec Dt:
03/08/2019
Assignee:
101 N. SEPULVEDA BLVD.
EL SEGUNDO, CALIFORNIA 90245
Correspondent:
MURPHY, BILAK & HOMILLER/INFINEON
1255 CRESCENT GREEN, SUITE 200
CARY, NC 27518
Assignment: 2
Reel/Frame:
050325/0031Recorded: 09/10/2019Pages: 6
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignors:
Exec Dt:
09/05/2019
Exec Dt:
02/25/2019
Assignee:
SIEMENSSTRASSE 2
VILLACH, AUSTRIA 9500
Correspondent:
MURPHY, BILAK & HOMILLER/INFINEON TECHNO
1255 CRESCENT GREEN
SUITE 200
CARY, NC 27518
Assignment: 3
Reel/Frame:
053033/0077Recorded: 06/25/2020Pages: 5
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignor:
Exec Dt:
06/24/2020
Assignee:
SIEMENSSTRASSE 2
VILLACH, AUSTRIA A-9500
Correspondent:
IRIS DRUCKENBROD
AM CAMPEON 1-15
PATENT DEPARTMENT MUC/11.2.348
NEUBIBERG, 85579 GERMANY

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