Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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07/27/2021
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Application #:
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16867126
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Filing Dt:
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05/05/2020
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Publication #:
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Pub Dt:
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08/20/2020
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Inventors:
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Ryosuke KATAOKA, Takashi TAMOGAMI, Syuhei OSHIDA
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Title:
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METHOD FOR PROCESSING WAFER
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 2968-2, ISHIKAWA-MACHI |
| HACHIOJI-SHI, TOKYO, JAPAN 192-8515 |
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| BIRCH STEWART KOLASCH & BIRCH LLP |
| 8110 GATEHOUSE ROAD, SUITE 100E |
| FALLS CHURCH, VA 22042 |
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