Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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08/03/2021
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Application #:
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16514853
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Filing Dt:
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07/17/2019
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Publication #:
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Pub Dt:
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11/07/2019
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Inventors:
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Sook Woon CHAN, Chau Fatt CHIANG, Kok Yau CHUA, Soon Lock GOH, Swee Kah LEE et al
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Title:
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Manufacturing a package using plateable encapsulant
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| AM CAMPEON 1-15 |
| NEUBIBERG, GERMANY 85579 |
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| CLIFFORD B. PERRY |
| 270 N. EL CAMINO REAL |
| NO. F-347 |
| ENCINITAS, CA 92024 |
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